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Chip sirkuit terintegrasi QFN-32 serbaguna dengan arus pasokan 2,5mA
| Mounting Type: | Surface Mount |
|---|---|
| Propagation Delay: | 2.5ns |
| Voltage - Supply: | 2.5 V ~ 5.5 V |
2.54mm Pitch DIP Female Header Connector dengan Fosfor Bronze Contact Material
| Voltage Rating: | 250V |
|---|---|
| Insulator Material: | Polyester |
| Insulation Resistance: | 1000MΩ Min |
8 Output Chip sirkuit terpadu dalam tegangan pasokan operasi 2,5V - 5,5V
| Package Type: | QFN |
|---|---|
| Propagation Delay: | 2.5ns |
| Power Dissipation: | 1.2W |
Tipe pemasangan melalui lubang DIP Resistensi isolasi 1000MΩ Min
| Mounting Type: | Through Hole |
|---|---|
| Contact Resistance: | 20mΩ Max |
| Insulation Resistance: | 1000MΩ Min |
Kompak QFN Integrated Circuit Chip - Supply Current 2.5mA untuk Keandalan Tinggi
| Mounting Type: | Surface Mount |
|---|---|
| Voltage - Supply: | 2.5 V ~ 5.5 V |
| Package Type: | QFN |
2.54mm Pitch DIP Connector dengan Solder Termination Method
| Current Rating: | 1A |
|---|---|
| Insulation Resistance: | 1000MΩ Min |
| Connector Type: | DIP |
Solder Termination DIP dengan 500V AC Dielectric Resisting Voltage
| Connector Type: | DIP |
|---|---|
| Contact Resistance: | 20mΩ Max |
| Contact Material: | Phosphor Bronze |
Sirkuit terpadu kompak dengan Protokol Komunikasi Modbus/CANbus 50mm*50mm*20mm
| Operating Temperature: | 0°C To 70°C |
|---|---|
| Dimension: | 50mm*50mm*20mm |
| Power Supply: | DC/AC |
DIP yang hemat biaya dengan pemasangan melalui lubang dan plat kontak emas
| Current Rating: | 1A |
|---|---|
| Mounting Type: | Through Hole |
| Voltage Rating: | 250V |
Pasokan arus operasi 2.5mA Chip sirkuit terpadu untuk aplikasi permukaan
| Package / Case: | QFN-32 |
|---|---|
| Frequency: | 50MHz |
| Propagation Delay: | 2.5ns |