Semua produk
QFN Integrated Circuit Chip dengan Controller IC Chip Dirancang untuk Controller dan Lebih Banyak
| Package / Case: | QFN-32 |
|---|---|
| Operating Supply Current: | 2.5mA |
| Propagation Delay: | 2.5ns |
Resistensi isolasi 1000MΩ Min untuk DIP Resistensi kontak 20mΩ Max
| Contact Resistance: | 20mΩ Max |
|---|---|
| Contact Material: | Phosphor Bronze |
| Connector Type: | DIP |
Chip IC pengontrol dengan frekuensi 50MHz - Chip sirkuit terintegrasi
| Package Type: | QFN |
|---|---|
| Frequency: | 50MHz |
| Interface Type: | I2C, SPI, UART |
DIP tahan suhu -55°C sampai 105°C. Metode Terminasi Solder
| Number of Rows: | 1-4 |
|---|---|
| Pitch: | 2.54mm |
| Insulator Material: | Polyester |
ESR 0,04Ω Aluminium Kondensator Elektrolitik dengan 5mm Lead Spacing
| Lead Spacing: | 5mm |
|---|---|
| Lead Length: | 5mm |
| Ripple Current: | 1.2A |
Sirkuit terpadu dengan rasio pengambilan sampel tinggi dengan akurasi presisi ±0,1%
| Power Supply: | DC Or AC |
|---|---|
| Protection: | IP67 |
| Size: | Small |
Contact Plating Gold Dan DIP Dengan Ketahanan Suhu Tinggi 55°C Sampai 105°C
| Connector Type: | DIP |
|---|---|
| Contact Plating: | Gold |
| Pitch: | 2.54mm |
Chip sirkuit terintegrasi SPI tahan lama 2.5mA Pasokan arus Kinerja tahan lama
| Current - Output High, Low: | 24mA, 24mA |
|---|---|
| Operating Temperature: | -40°C ~ 85°C |
| Power Dissipation: | 1.2W |
Integrated Bootstrap Capacitor Power Supply ICs -40°C sampai 85°C andal dan efisien
| Integrated FETs: | Yes |
|---|---|
| Integrated Bootstrap Capacitor: | Yes |
| Package Type: | SOP, SOIC, QFN, DIP |
Konektor DIP yang dapat diandalkan -55°C hingga 105°C Kisaran suhu Resistensi kontak rendah
| Number of Contacts: | 2-64 |
|---|---|
| Mounting Type: | Through Hole |
| Dielectric Withstanding Voltage: | 500V AC |